OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
Pursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2019-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2019.01.017 |