OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM

Pursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by...

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Main Authors: CHEN YuLong, LI ShuJuan, BU WenHao, WANG XinYi
Format: Article
Language:zho
Published: Editorial Office of Journal of Mechanical Strength 2019-01-01
Series:Jixie qiangdu
Subjects:
Online Access:http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2019.01.017
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author CHEN YuLong
LI ShuJuan
BU WenHao
WANG XinYi
author_facet CHEN YuLong
LI ShuJuan
BU WenHao
WANG XinYi
author_sort CHEN YuLong
collection DOAJ
description Pursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by response surface method,The variance analysis shows that the model equation is significant. The improved non-dominated genetic algorithm( NSGA-II) is used to optimize processing process,and we can get a set of non-dominated solutions. These non-dominated solutions can satisfy the needs of engineering workers under different conditions. The corresponding experimental proving the non-dominated solution is feasible.
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publisher Editorial Office of Journal of Mechanical Strength
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spelling doaj.art-78e5ac63aa814d2581e0478c0b24d3782025-01-15T02:30:34ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692019-01-01419810330603742OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHMCHEN YuLongLI ShuJuanBU WenHaoWANG XinYiPursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by response surface method,The variance analysis shows that the model equation is significant. The improved non-dominated genetic algorithm( NSGA-II) is used to optimize processing process,and we can get a set of non-dominated solutions. These non-dominated solutions can satisfy the needs of engineering workers under different conditions. The corresponding experimental proving the non-dominated solution is feasible.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2019.01.017Wire electrical discharge machiningMonocrystalline siliconResponse surface methodNSGA Ⅱ
spellingShingle CHEN YuLong
LI ShuJuan
BU WenHao
WANG XinYi
OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
Jixie qiangdu
Wire electrical discharge machining
Monocrystalline silicon
Response surface method
NSGA Ⅱ
title OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
title_full OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
title_fullStr OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
title_full_unstemmed OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
title_short OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
title_sort optimize process of wedm monocrystalline silicon base on response sueface method and improved non dominated genetic algorithm
topic Wire electrical discharge machining
Monocrystalline silicon
Response surface method
NSGA Ⅱ
url http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2019.01.017
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