Effect of thermal cycling on the strain and stress distribution of TSVs and solder bumps in stacked package structure
Aerospace exploration requires electronic devices to withstand the test of extreme environments, and it is of great significance to study the reliability of packaged devices at extreme temperatures. In this paper, the Anand model is used to describe the mechanical constitutive behavior of Sn-3.0Ag-0...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2023-09-01
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Series: | e-Prime: Advances in Electrical Engineering, Electronics and Energy |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2772671123001699 |