Effect of thermal cycling on the strain and stress distribution of TSVs and solder bumps in stacked package structure

Effect of thermal cycling on the strain and stress distribution of TSVs and solder bumps in stacked package structure

Aerospace exploration requires electronic devices to withstand the test of extreme environments, and it is of great significance to study the reliability of packaged devices at extreme temperatures. In this paper, the Anand model is used to describe the mechanical constitutive behavior of Sn-3.0Ag-0...

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Bibliographic Details
Main Authors: Yangjing Xia, Yahui Su, Xin Xu, Lina Ju, Rui Zhang, Yuxiong Xue, Yang Liu, Shuye Zhang
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:e-Prime: Advances in Electrical Engineering, Electronics and Energy
Subjects:
Finite element simulation
Thermal cycling
C4 bump
TSV
Fatigue life
Online Access:http://www.sciencedirect.com/science/article/pii/S2772671123001699

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http://www.sciencedirect.com/science/article/pii/S2772671123001699

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