Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion

The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successfu...

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Bibliographic Details
Main Authors: Martin Hubmann, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur, Thomas Lucyshyn
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Polymers
Subjects:
injection molding
simulation
in-mold electronics
structural electronic
flexible electronics
overmolding
Online Access:https://www.mdpi.com/2073-4360/14/23/5060

Internet

https://www.mdpi.com/2073-4360/14/23/5060

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