Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper
Cu/SiO2 hybrid bonding has been developed for the application of heterogeneous bond interfaces in 3D integrated circuits in which thermal stability and bonding behavior are important. Thus, nano-twinned Cu (NT-Cu) is selected as the bonding material, and the thermal stability of NT-Cu and the bondin...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2022-06-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0088158 |