Thermal Transport in Extremely Confined Metallic Nanostructures: TET Characterization

In recent years, the continuous development of electronic chips and the increasing integration of devices have led to extensive research on the thermal properties of ultrathin metallic materials. In particular, accurate characterization of their thermal transport properties has become a research hot...

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Bibliographic Details
Main Authors: Huan Lin, Fuhua Shen, Jinbo Xu, Lijun Zhang, Shen Xu, Na Liu, Siyi Luo
Format: Article
Language:English
Published: MDPI AG 2022-12-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/13/1/140