Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization

Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization

This study aims to establish an accurate prediction model using artificial neural networks (ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip-scale package (FCCSP). To enhance model performance, a novel subdomain-based sampling strategy and Taguchi hyperpar...

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Bibliographic Details
Main Authors: Hsien-Chie Cheng, Chia-Lin Ma, Yang-Lun Liu
Format: Article
Language:English
Published: MDPI AG 2023-06-01
Series:Micromachines
Subjects:
flip-chip chip-scale package
warpage prediction model
artificial neural network
process modeling
hyperparameter optimization
sampling strategy
Online Access:https://www.mdpi.com/2072-666X/14/7/1325

Internet

https://www.mdpi.com/2072-666X/14/7/1325

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