Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
The crack growth resistance under thermal shock loading on silicon nitride was characterized using Disc-on-Rod test which was developed by the authors. The microdamage during thermal shock fracture was monitored by acoustic emission (AE) technique. Specimens were composed of β-Si3N4 with an acicular...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2014-02-01
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| Series: | Mechanical Engineering Journal |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/mej/1/1/1_2014smm0002/_pdf/-char/en |