Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging

Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging

Chip bonding, an essential process in power semiconductor device packaging, commonly includes welding and nano-silver sintering. Currently, most of the research on chip bonding technology focuses on the thermal stress analysis of tin–lead solder and nano-silver pressure-assisted sintering, whereas r...

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Bibliographic Details
Main Authors: Wenchao Tian, Dexin Li, Haojie Dang, Shiqian Liang, Yizheng Zhang, Xiaojun Zhang, Si Chen, Xiaochuan Yu
Format: Article
Language:English
Published: MDPI AG 2024-08-01
Series:Micromachines
Subjects:
nano-silver paste
pressureless sintering
SiC
residual stress
warpage
Online Access:https://www.mdpi.com/2072-666X/15/9/1087

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https://www.mdpi.com/2072-666X/15/9/1087

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