An Optimization Framework for the Design of High-Speed PCB VIAs
Signal integrity represents a key issue in all modern electronic systems, which are strongly dominated by the extreme component density usually employed on PCBs and the associated increase in the interconnection density. The use of multi-layer structures with microstrips connected by various types o...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-02-01
|
| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/11/3/475 |