Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the nanoscale precision removal of Cu in integrated...

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Bibliographic Details
Main Authors: Shuai Wang, Yaoyu Wang, Shizhuo Zhang, Lingfeng Wang, Shuai Chen, Huai Zheng, Chen Zhang, Sheng Liu, Gary J. Cheng, Feng Liu
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Micromachines
Subjects:
Cu removal
plasma oxidation
femtosecond laser ablation
roughness
nm
Online Access:https://www.mdpi.com/2072-666X/12/10/1188

Internet

https://www.mdpi.com/2072-666X/12/10/1188

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