THE EFFECT OF THE GRANULOMETRIC COMPOSITION OF THE FILLER AND HEAT TREATMENT ON THE ADHESION STRENGTH OF MULTILAYER METAL COATING ON AlSiC MMС’S SURFACE
Background. Modern semiconductor power devices (SPD) contain temperature compensators (TC) in their design, which can be made of a metal matrix composite material based on an aluminum matrix alloy and silicon carbide micropowder (MMC AlSiC). A multilayer metal coating is applied to the TC surface...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penza State University Publishing House
2020-12-01
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| Series: | Известия высших учебных заведений. Поволжский регион: Физико-математические науки |
| Subjects: |