Compact Thermal Modeling of Power Semiconductor Devices with the Influence of Atmospheric Pressure
The efficiency of the heat dissipation process generated in semiconductor devices depends on many factors, related both to the parameters of the cooling system and environmental factors. Regarding the latter factors, ambient temperature and volume in which the device operates are typically indicated...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-05-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/15/10/3565 |