Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions
It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand their growth mechanism, this study employed phase...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-01-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/14/2/139 |