Evolution of microstructures and properties leading to layer instabilities during accumulative roll bonding of FeCu, FeAg, and FeAl

Evolution of microstructures and properties leading to layer instabilities during accumulative roll bonding of FeCu, FeAg, and FeAl

Bi-metallic laminates (bcc/fcc) containing Fe and either Cu, Ag, or Al were processed by cold accumulative roll bonding (ARB). The evolving microstructures and properties were measured using optical microcopy, electron backscatter diffraction (EBSD), and nano-indentation up to and beyond when layer...

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Bibliographic Details
Main Authors: Rodney J. McCabe, Thomas J. Nizolek, Nan Li, Yifan Zhang, Daniel R. Coughlin, Cody Miller, John S. Carpenter
Format: Article
Language:English
Published: Elsevier 2021-12-01
Series:Materials & Design
Subjects:
Accumulative roll bonding
EBSD
Nano-indentation
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127521007590

Internet

http://www.sciencedirect.com/science/article/pii/S0264127521007590

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