Preparation of W-Plated Diamond and Improvement of Thermal Conductivity of Diamond-WC-Cu Composite
The tungsten (W)-plated diamond process was explored and optimized. A dense and uniform tungsten coating with a thickness of 900 nm was successfully prepared by the powder covering sintering method. The Diamond-WC-Cu composite with high density and high thermal conductivity were successfully prepare...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/11/3/437 |