Siloxane‐containing polyimide films with high heat resistance and low dielectric constant

Siloxane‐containing polyimide films with high heat resistance and low dielectric constant

Abstract A series of siloxane‐containing polyimide films (PIS) were prepared by copolymerising with rigid aromatic dianhydride, siloxane diamines and six different aromatic diamines. The effects of siloxane structures, fluorine and imide content, rigid or flexible segment on the heat resistance, moi...

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Bibliographic Details
Main Authors: Song Mo, Lei Zhai, Yi Liu, Gang Han, Yan Jia, Min‐Hui He, Lin Fan
Format: Article
Language:English
Published: Wiley 2024-03-01
Series:IET Nanodielectrics
Subjects:
dielectric losses
dielectric materials
dielectric thin films
materials preparation
polymer films
polymerisation
Online Access:https://doi.org/10.1049/nde2.12064

Internet

https://doi.org/10.1049/nde2.12064

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