Optimization of stepwise varying width microchannel heat sink for high heat flux applications
The semiconductor devices are widely employed for many applications. A significant amount of the heat must be dissipated properly to keep the devices' performance stable. Additionally, under high operation temperatures, a physical damage is possible due to thermal stresses that threaten the saf...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-04-01
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| Series: | Case Studies in Thermal Engineering |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X19304034 |