Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures

In the work, the cryogenic and room temperature drawing behaviors of Cu–Te alloy with a wide range of accumulative drawing true strain up to 1.1 are systematically investigated. For the first time, the storage of geometrically necessary dislocations (GND) and statically stored dislocations (SSD), oc...

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Bibliographic Details
Main Authors: Qianqian Fu, Bing Li, Hongwang Fu, Minqiang Gao, Changfeng Wang, Ying Fu, Renguo Guan
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423020677