Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures
In the work, the cryogenic and room temperature drawing behaviors of Cu–Te alloy with a wide range of accumulative drawing true strain up to 1.1 are systematically investigated. For the first time, the storage of geometrically necessary dislocations (GND) and statically stored dislocations (SSD), oc...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423020677 |
| _version_ | 1827780454907904000 |
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| author | Qianqian Fu Bing Li Hongwang Fu Minqiang Gao Changfeng Wang Ying Fu Renguo Guan |
| author_facet | Qianqian Fu Bing Li Hongwang Fu Minqiang Gao Changfeng Wang Ying Fu Renguo Guan |
| author_sort | Qianqian Fu |
| collection | DOAJ |
| description | In the work, the cryogenic and room temperature drawing behaviors of Cu–Te alloy with a wide range of accumulative drawing true strain up to 1.1 are systematically investigated. For the first time, the storage of geometrically necessary dislocations (GND) and statically stored dislocations (SSD), occurrence of deformation twinning, as well as their respective roles in strain hardening in the drawn Cu–Te alloy at cryogenic and room temperature have been studied. The results show that the liquid nitrogen temperature drawn (LNT-D) Cu–Te alloy presents higher yield strength (YS), ultimate tensile strength than the room temperature drawn (RT-D) Cu–Te alloy. Microstructural investigation reveals that cryogenic wire drawing of Cu–Te alloy promotes the formation of simultaneous twinning and shear bands, accompanied by the fragmentation of Cu2Te phase. The LNT-D Cu–Te alloy exhibits planar slip characteristics, while RT-D Cu–Te alloy presents wave slip characteristics. Compared with RT-D Cu–Te alloy, the higher YS of LNT-D Cu–Te alloy can be mainly attributed to dislocation strengthening and twinning strengthening, which account for 76.25–80.45% and 4.79–4.91% of the total YS respectively. During room temperature drawing, both GND and SSD play an important role in the hardening of Cu–Te alloy. During cryogenic temperature drawing, work hardening is predominantly through rapid multiplication of SSDs. |
| first_indexed | 2024-03-11T15:05:49Z |
| format | Article |
| id | doaj.art-7da29d3a1a694258b6e6b843ca83d54e |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-11T15:05:49Z |
| publishDate | 2023-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-7da29d3a1a694258b6e6b843ca83d54e2023-10-30T06:04:00ZengElsevierJournal of Materials Research and Technology2238-78542023-09-012664196432Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperaturesQianqian Fu0Bing Li1Hongwang Fu2Minqiang Gao3Changfeng Wang4Ying Fu5Renguo Guan6Key Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Shanxi Datong University, Datong 037009, ChinaKey Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, China; Corresponding author. Key Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China.Key Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, ChinaKey Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, ChinaKey Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, ChinaKey Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Songshan Lake Materials Laboratory, Dongguan, Dongguan 523808, ChinaKey Laboratory of Near-Net Forming of Light Metals of Liaoning Province, Dalian Jiaotong University, Dalian 116028, China; Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, China; Corresponding author. Engineering Research Center of Continuous Extrusion, Ministry of Education, Dalian Jiaotong University, Dalian 116028, China.In the work, the cryogenic and room temperature drawing behaviors of Cu–Te alloy with a wide range of accumulative drawing true strain up to 1.1 are systematically investigated. For the first time, the storage of geometrically necessary dislocations (GND) and statically stored dislocations (SSD), occurrence of deformation twinning, as well as their respective roles in strain hardening in the drawn Cu–Te alloy at cryogenic and room temperature have been studied. The results show that the liquid nitrogen temperature drawn (LNT-D) Cu–Te alloy presents higher yield strength (YS), ultimate tensile strength than the room temperature drawn (RT-D) Cu–Te alloy. Microstructural investigation reveals that cryogenic wire drawing of Cu–Te alloy promotes the formation of simultaneous twinning and shear bands, accompanied by the fragmentation of Cu2Te phase. The LNT-D Cu–Te alloy exhibits planar slip characteristics, while RT-D Cu–Te alloy presents wave slip characteristics. Compared with RT-D Cu–Te alloy, the higher YS of LNT-D Cu–Te alloy can be mainly attributed to dislocation strengthening and twinning strengthening, which account for 76.25–80.45% and 4.79–4.91% of the total YS respectively. During room temperature drawing, both GND and SSD play an important role in the hardening of Cu–Te alloy. During cryogenic temperature drawing, work hardening is predominantly through rapid multiplication of SSDs.http://www.sciencedirect.com/science/article/pii/S2238785423020677Cu–Te alloyDeformation twinGeometrically necessary dislocationsStatistically stored dislocationsCryogenic drawing |
| spellingShingle | Qianqian Fu Bing Li Hongwang Fu Minqiang Gao Changfeng Wang Ying Fu Renguo Guan Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures Journal of Materials Research and Technology Cu–Te alloy Deformation twin Geometrically necessary dislocations Statistically stored dislocations Cryogenic drawing |
| title | Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures |
| title_full | Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures |
| title_fullStr | Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures |
| title_full_unstemmed | Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures |
| title_short | Dislocation behavior and strengthening mechanisms of Cu–Te alloy drawn at room and cryogenic temperatures |
| title_sort | dislocation behavior and strengthening mechanisms of cu te alloy drawn at room and cryogenic temperatures |
| topic | Cu–Te alloy Deformation twin Geometrically necessary dislocations Statistically stored dislocations Cryogenic drawing |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423020677 |
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