Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation
To develop a lead-free solder with high strength and ductility, a novel interface was designed between the tetra-needle-like ZnO whisker (T-ZnOw) and Sn1.0Ag0.5Cu solder matrix. First, surface modification of T-ZnOw was conducted using a pyrolysis method based on self-assembly to deposit NiO nanopar...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127521005931 |