Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and pure Sn solder. After aging processes, a new IM...
| मुख्य लेखकों: | , , , , , , |
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| स्वरूप: | लेख |
| भाषा: | English |
| प्रकाशित: |
MDPI AG
2018-12-01
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| श्रृंखला: | Applied Sciences |
| विषय: | |
| ऑनलाइन पहुंच: | https://www.mdpi.com/2076-3417/8/12/2703 |