Numerical study on the effect of thermal pad on enhancing interfacial heat transfer considering thermal contact resistance
In this paper, a 3D numerical model was established to investigate the effect of thermal pad on enhancing heat transfer of rough contact interfaces. The model is a sandwich structure and it includes chip, thermal pad and heat sink. The results indicate that the elastic modulus of the thermal pad can...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
|
| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X23005324 |