Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development
Digital light processing (DLP) 3D printing technology has the advantage of rapid preparation of high-precision complex devices. However, photosensitive resin's insufficient high-temperature resistance and mechanical properties limit its application in aerospace and structural functional devices...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-03-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127523001557 |