Aging tests of mini-modules with copper-plated heterojunction solar cells and pattern-transfer-printing of copper paste

Aging tests of mini-modules with copper-plated heterojunction solar cells and pattern-transfer-printing of copper paste

Abstract: Mini-module aging tests with differently interconnected heterojunction solar cells having industrially viable copper metallization are presented. The plating process comprises 3 steps: firstly, screen printing of a seed-grid layout using a copper-based paste, followed by deposition of a di...

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Bibliographic Details
Main Authors: Lachowicz Agata, Badel Nicolas, Barrou Alexis, Barth Vincent, Harrison Samuel, Frasson Nicola, Galiazzo Marco, Cohen Natali, Cohen Eyal, Zhao Jun, Paviet-Salomon Bertrand, Ballif Christophe
Format: Article
Language:English
Published: EDP Sciences 2024-01-01
Series:EPJ Photovoltaics
Subjects:
heterojunction solar cells
copper metallization
plating
module stability
pattern transfer printing
electrodeposition
Online Access:https://www.epj-pv.org/articles/epjpv/full_html/2024/01/pv230062/pv230062.html

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https://www.epj-pv.org/articles/epjpv/full_html/2024/01/pv230062/pv230062.html

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