Capturing the Dynamics of Ti Diffusion Across TixW1−x/Cu Heterostructures using X‐Ray Photoelectron Spectroscopy

Capturing the Dynamics of Ti Diffusion Across TixW1−x/Cu Heterostructures using X‐Ray Photoelectron Spectroscopy

Abstract Interdiffusion phenomena between adjacent materials are highly prevalent in semiconductor device architectures and can present a major reliability challenge for the industry. To fully capture these phenomena, experimental approaches must go beyond static and post‐mortem studies to include i...

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Bibliographic Details
Main Authors: Curran Kalha, Pardeep K. Thakur, Tien‐Lin Lee, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, Anna Regoutz
Format: Article
Language:English
Published: Wiley-VCH 2023-12-01
Series:Advanced Physics Research
Subjects:
diffusion barriers
HAXPES
metallisation
power electronic devices
SXPS
XPS
Online Access:https://doi.org/10.1002/apxr.202300008

Internet

https://doi.org/10.1002/apxr.202300008

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