Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing
Laser soldering has attracted attention in microbumps joining field due to its noncontact and localized heating, a short joining time, fluxless and easy automation. In this study, Sn-3.0Ag-0.5Cu/Ni–P microbumps were prepared by laser soldering and reflow soldering respectively, then the effects of i...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424002734 |