Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review

Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review

In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for which high reliability level is imperative. The...

Full description

Bibliographic Details
Main Authors: Ephraim Suhir, Reza Ghaffarian
Format: Article
Language:English
Published: MDPI AG 2018-07-01
Series:Aerospace
Subjects:
aerospace electronics
flip-chip
FC and FPBGA, underfill
predictive modeling
reliability
Online Access:http://www.mdpi.com/2226-4310/5/3/74

Internet

http://www.mdpi.com/2226-4310/5/3/74

Similar Items