Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures

Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures

A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep reactive ion etching (DRIE) of silicon vias and selective tungsten coating onto them using a shadow mask are combined with glass...

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Bibliographic Details
Main Authors: Ik-Jae Hyeon, Chang-Wook Baek
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Micromachines
Subjects:
substrate integrated waveguide (SIW)
tungsten-coated through glass silicon via (TGVS)
through glass via (TGV)
glass reflow
Online Access:http://www.mdpi.com/2072-666X/9/4/172

Internet

http://www.mdpi.com/2072-666X/9/4/172

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