Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic

Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic

The microstructural, creep resistance and electrical conductivity properties of Sn-0.7Cu (SC07) alloy with Bi-additions in concentrations of (0.3 and 0.5 wt%) have been investigated using x-ray diffraction (XRD), Scanning electron microscope (SEM), creep testing machine and (DC) circuit respectively...

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Bibliographic Details
Main Authors: Shakib Alsowidy, Ahmed M. Aljarbani, Mohammed S. Gumaan
Format: Article
Language:English
Published: Elsevier 2022-12-01
Series:Results in Materials
Subjects:
Eutectic Sn–Cu
Rupture time
Stress exponent
Creep resistance
Particle size
And IMC
Online Access:http://www.sciencedirect.com/science/article/pii/S2590048X2200067X

Internet

http://www.sciencedirect.com/science/article/pii/S2590048X2200067X

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