Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
The development of integrated circuits has increased the size of chip interconnects, which has brought challenges to interconnect design in chip packages. The closer the spacing between interconnects, the higher the space utilization, which can cause severe crosstalk problems in high-speed circuits....
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/5/1033 |