Microstructure induced duplex Hall-Petch effect and its strengthening/toughening mechanisms in SiC@TC4 composites prepared by spark plasma sintering
Microstructure induced duplex Hall-Petch effect and its strengthening/toughening mechanisms in SiC@TC4 composites prepared by spark plasma sintering were systematically investigated in the current study. The microstructure characterization demonstrated that SiC additions significantly tailored the m...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424003259 |