Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks

In this paper, the possibility of determining the thermal, elastic and geometric characteristics of a thin TiO<sub>2</sub> film deposited on a silicon substrate, with a thickness of 30 μm, in the frequency range of 20 to 20 kHz with neural networks were analysed. For this purpose, the ge...

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Main Authors: Katarina Lj Djordjević, Dragana K. Markushev, Marica N. Popović, Mioljub V. Nesić, Slobodanka P. Galović, Dragan V. Lukić, Dragan D. Markushev
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Materials
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Online Access:https://www.mdpi.com/1996-1944/16/7/2865
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author Katarina Lj Djordjević
Dragana K. Markushev
Marica N. Popović
Mioljub V. Nesić
Slobodanka P. Galović
Dragan V. Lukić
Dragan D. Markushev
author_facet Katarina Lj Djordjević
Dragana K. Markushev
Marica N. Popović
Mioljub V. Nesić
Slobodanka P. Galović
Dragan V. Lukić
Dragan D. Markushev
author_sort Katarina Lj Djordjević
collection DOAJ
description In this paper, the possibility of determining the thermal, elastic and geometric characteristics of a thin TiO<sub>2</sub> film deposited on a silicon substrate, with a thickness of 30 μm, in the frequency range of 20 to 20 kHz with neural networks were analysed. For this purpose, the geometric (thickness), thermal (thermal diffusivity, coefficient of linear expansion) and electronic parameters of substrates were known and constant in the two-layer model, while the following nano-layer thin-film parameters were changed: thickness, expansion and thermal diffusivity. Predictions of these three parameters of the thin-film were analysed separately with three neural networks. All of them together were joined by a fourth neural network. It was shown that the neural network, which analysed all three parameters at the same time, achieved the highest accuracy, so the use of networks that provide predictions for only one parameter is less reliable. The obtained results showed that the application of neural networks in determining the thermoelastic properties of a thin film on a supporting substrate enables the estimation of its characteristics with great accuracy.
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spelling doaj.art-81ce537e8c1c4a75a638f9b7dd95fa932023-11-17T17:06:16ZengMDPI AGMaterials1996-19442023-04-01167286510.3390/ma16072865Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural NetworksKatarina Lj Djordjević0Dragana K. Markushev1Marica N. Popović2Mioljub V. Nesić3Slobodanka P. Galović4Dragan V. Lukić5Dragan D. Markushev6“Vinča” Institute of Nuclear Sciences, National Institute of the Republic of Serbia, University of Belgrade, P.O. Box 522, 11000 Belgrade, SerbiaInstitute of Physics Belgrade, National Institute of the Republic of Serbia, Pregrevica 118, University of Belgrade, Zemun, 11080 Belgrade, SerbiaInstitute of Physics Belgrade, National Institute of the Republic of Serbia, Pregrevica 118, University of Belgrade, Zemun, 11080 Belgrade, Serbia“Vinča” Institute of Nuclear Sciences, National Institute of the Republic of Serbia, University of Belgrade, P.O. Box 522, 11000 Belgrade, Serbia“Vinča” Institute of Nuclear Sciences, National Institute of the Republic of Serbia, University of Belgrade, P.O. Box 522, 11000 Belgrade, SerbiaInstitute of Physics Belgrade, National Institute of the Republic of Serbia, Pregrevica 118, University of Belgrade, Zemun, 11080 Belgrade, SerbiaInstitute of Physics Belgrade, National Institute of the Republic of Serbia, Pregrevica 118, University of Belgrade, Zemun, 11080 Belgrade, SerbiaIn this paper, the possibility of determining the thermal, elastic and geometric characteristics of a thin TiO<sub>2</sub> film deposited on a silicon substrate, with a thickness of 30 μm, in the frequency range of 20 to 20 kHz with neural networks were analysed. For this purpose, the geometric (thickness), thermal (thermal diffusivity, coefficient of linear expansion) and electronic parameters of substrates were known and constant in the two-layer model, while the following nano-layer thin-film parameters were changed: thickness, expansion and thermal diffusivity. Predictions of these three parameters of the thin-film were analysed separately with three neural networks. All of them together were joined by a fourth neural network. It was shown that the neural network, which analysed all three parameters at the same time, achieved the highest accuracy, so the use of networks that provide predictions for only one parameter is less reliable. The obtained results showed that the application of neural networks in determining the thermoelastic properties of a thin film on a supporting substrate enables the estimation of its characteristics with great accuracy.https://www.mdpi.com/1996-1944/16/7/2865thin-filmTiO<sub>2</sub>photoacousticartificial neural networksthermal diffusionthermal expansion
spellingShingle Katarina Lj Djordjević
Dragana K. Markushev
Marica N. Popović
Mioljub V. Nesić
Slobodanka P. Galović
Dragan V. Lukić
Dragan D. Markushev
Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
Materials
thin-film
TiO<sub>2</sub>
photoacoustic
artificial neural networks
thermal diffusion
thermal expansion
title Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
title_full Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
title_fullStr Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
title_full_unstemmed Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
title_short Photoacoustic Characterization of TiO<sub>2</sub> Thin-Films Deposited on Silicon Substrate Using Neural Networks
title_sort photoacoustic characterization of tio sub 2 sub thin films deposited on silicon substrate using neural networks
topic thin-film
TiO<sub>2</sub>
photoacoustic
artificial neural networks
thermal diffusion
thermal expansion
url https://www.mdpi.com/1996-1944/16/7/2865
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