Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding
A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding process. The sinter-bonding produced a dense Cu–C...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423031770 |