Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding
A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding process. The sinter-bonding produced a dense Cu–C...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423031770 |
| _version_ | 1797338295631347712 |
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| author | Wan-Geun Lee Kwang-Seong Choi Yong-Sung Eom Jong-Hyun Lee |
| author_facet | Wan-Geun Lee Kwang-Seong Choi Yong-Sung Eom Jong-Hyun Lee |
| author_sort | Wan-Geun Lee |
| collection | DOAJ |
| description | A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding process. The sinter-bonding produced a dense Cu–Cu joint with minimal oxidation by infiltrating the reducing agent into the NPS Cu layer. Sinter-bonding was performed with under a pressure of 5 MPa at 300 °C in air, and excellent bonding strength of 27 MPa was achieved after a bonding time of 1 min. Moreover, the bonding strength increased to 35 MPa by bonding for 1 min while blowing N2. The optimal thickness of the NPS Cu layer for short-duration sinter-bonding was established, and the oxidation of Cu was suppressed by the infiltration of a reducing agent. Consequently, an excellent shear strength was achieved by sinter-bonding using the NPS Cu layer. |
| first_indexed | 2024-03-08T09:28:55Z |
| format | Article |
| id | doaj.art-8281e9206d02475b8cbb50bb02a4743b |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-08T09:28:55Z |
| publishDate | 2024-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-8281e9206d02475b8cbb50bb02a4743b2024-01-31T05:43:38ZengElsevierJournal of Materials Research and Technology2238-78542024-01-012819671974Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bondingWan-Geun Lee0Kwang-Seong Choi1Yong-Sung Eom2Jong-Hyun Lee3Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of KoreaLow-Carbon Integration Tech, Creative Research Section, ETRI, Daejeon, 34129, Republic of KoreaLow-Carbon Integration Tech, Creative Research Section, ETRI, Daejeon, 34129, Republic of KoreaDepartment of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea; Materials Research Institute for Future Convergence, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea; Corresponding author. Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea.A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding process. The sinter-bonding produced a dense Cu–Cu joint with minimal oxidation by infiltrating the reducing agent into the NPS Cu layer. Sinter-bonding was performed with under a pressure of 5 MPa at 300 °C in air, and excellent bonding strength of 27 MPa was achieved after a bonding time of 1 min. Moreover, the bonding strength increased to 35 MPa by bonding for 1 min while blowing N2. The optimal thickness of the NPS Cu layer for short-duration sinter-bonding was established, and the oxidation of Cu was suppressed by the infiltration of a reducing agent. Consequently, an excellent shear strength was achieved by sinter-bonding using the NPS Cu layer.http://www.sciencedirect.com/science/article/pii/S2238785423031770Zn platingAnnealingSelective etchingNano-porous structured Cu layerSinter-bonding |
| spellingShingle | Wan-Geun Lee Kwang-Seong Choi Yong-Sung Eom Jong-Hyun Lee Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding Journal of Materials Research and Technology Zn plating Annealing Selective etching Nano-porous structured Cu layer Sinter-bonding |
| title | Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding |
| title_full | Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding |
| title_fullStr | Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding |
| title_full_unstemmed | Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding |
| title_short | Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding |
| title_sort | formation of a nano porous structured cu layer by selective etching of a brass layer and sinter bonding to achieve direct cu cu bonding |
| topic | Zn plating Annealing Selective etching Nano-porous structured Cu layer Sinter-bonding |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423031770 |
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