Numerical simulation of dust particle deposition and heat transfer in fin-plate radiators
Fin-plate radiators are actively used in cooling systems for microelectronic devices. Radiators often become dusty during operation, which leads to decrease in heat flow and heat dissipation. Consequently, the possibility of device overheating and failure increases. We carried out numerical studies...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
EDP Sciences
2023-01-01
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Series: | E3S Web of Conferences |
Online Access: | https://www.e3s-conferences.org/articles/e3sconf/pdf/2023/97/e3sconf_bft2023_08006.pdf |