Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

This study incorporated activated Ti nanoparticles (Ti NPs) into Sn1·0Ag0·5Cu (SAC105) solder for vacuum soldering with Cu substrates. The wettability, microstructure, interfacial, and mechanical properties of SAC105-xTi (x = 0.1, 0.2, 0.3, 0.4, 0.5 wt%) composite solder were systematically investig...

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Bibliographic Details
Main Authors: ChuanJiang Wu, Liang Zhang, Chen Chen, Xiao Lu
Format: Article
Language:English
Published: Elsevier 2024-01-01
Series:Journal of Materials Research and Technology
Subjects:
Vacuum soldering
Mechanical properties
Fracture path
Agglomeration
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423030387

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http://www.sciencedirect.com/science/article/pii/S2238785423030387

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