The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer
Double-sides polishing technology has the advantages of high flatness and parallelism, and high polishing efficiency. It is the preferred polishing method for the preparation of ultra-thin sapphire wafer. However, the clamping method is a fundamental problem which is currently difficult to solve. In...
| Main Authors: | , , , , , |
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| 格式: | 文件 |
| 语言: | English |
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MDPI AG
2020-08-01
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| 丛编: | Micromachines |
| 主题: | |
| 在线阅读: | https://www.mdpi.com/2072-666X/11/8/759 |