Temperature-Insensitive Structure Design of Micromachined Resonant Accelerometers

Temperature-Insensitive Structure Design of Micromachined Resonant Accelerometers

Micromachined resonant accelerometers (MRAs), especially those devices fabricated by silicon on glass technology, suffer from temperature drift error caused by inherent thermal stress. This paper proposes two structure designs to attenuate the effect of thermal stress. The first MRA structure is rea...

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Bibliographic Details
Main Authors: Yonggang Yin, Zhengxiang Fang, Yunfeng Liu, Fengtian Han
Format: Article
Language:English
Published: MDPI AG 2019-03-01
Series:Sensors
Subjects:
microelectromechanical systems (MEMS)
resonant accelerometer
silicon on glass (SOG)
temperature sensitivity
thermal stress
Online Access:https://www.mdpi.com/1424-8220/19/7/1544

Internet

https://www.mdpi.com/1424-8220/19/7/1544

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