Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF<sub>4</sub>/O<sub>2</sub> Plasma for Semiconductor Multilevel Interconnects
As semiconductor chips have been integrated to enhance their performance, a low-dielectric-constant material, SiCOH, with a relative dielectric constant <i>k</i> ≤ 3.5 has been widely used as an intermetal dielectric (IMD) material in multilevel interconnects to reduce the resistance-cap...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-06-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/16/13/4663 |