Study on polishing slurry of hydrogen peroxide-oxalic acid in CMP 304 stainless steel
Stainless steel will become the substrate material of the flexible display, requirements of the flexible substrate in the surface quality and performance are very strict. Chemical mechanical polishing (CMP) is one of the most appropriate technologies to achieve the surface processing of ultra-thin s...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2020-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2020/23/matecconf_icmie2020_02002.pdf |