Optimization of X-axis servo drive performance using PSO fuzzy control technique for double-axis dicing saw
Abstract The dicing saw is a critical piece of equipment in IC processing, primarily used to cut wafers. Due to the high spindle speed, even small errors in the cutting process can result in wafer chipping or cracking. Therefore, the dicing saw requires a high degree of accuracy and stability. In th...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2023-11-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-023-47663-y |