Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments
Abstract The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in detail. Based on the mixed lubrication...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2023-03-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40544-022-0668-8 |