In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface

This paper introduces a novel approach to in-process monitoring of the cutting temperature at the tool-chip interface (TCI). Currently, there are no tools available in the commercial market for measuring and monitoring cutting processes at the TCI region. Therefore, most of the studies about evaluat...

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Bibliographic Details
Main Authors: Heebum Chun, William Park, Jungsub Kim, ChaBum Lee
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Journal of Manufacturing and Materials Processing
Subjects:
Online Access:https://www.mdpi.com/2504-4494/6/5/97