In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
This paper introduces a novel approach to in-process monitoring of the cutting temperature at the tool-chip interface (TCI). Currently, there are no tools available in the commercial market for measuring and monitoring cutting processes at the TCI region. Therefore, most of the studies about evaluat...
Main Authors: | Heebum Chun, William Park, Jungsub Kim, ChaBum Lee |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-09-01
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Series: | Journal of Manufacturing and Materials Processing |
Subjects: | |
Online Access: | https://www.mdpi.com/2504-4494/6/5/97 |
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