Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)
Ultra-thin sapphire wafer processing is receiving increasing attention in the LED substrate industry. In the cascade clamping method, the motion state of the wafer determines the uniformity of material removal, while the motion state of the wafer is related to its friction coefficient in the biplane...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-05-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/6/1124 |