Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages

Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages

The reliability of packaged laser diodes is heavily dependent on the quality of the die attach. Even a small void or delamination may result in a sudden increase in junction temperature, eventually leading to failure of the operation. The contact thermal resistance at the interface between the die a...

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Bibliographic Details
Main Authors: Liting Deng, Te Li, Zhenfu Wang, Pu Zhang, Shunhua Wu, Jiachen Liu, Junyue Zhang, Lang Chen, Jiachen Zhang, Weizhou Huang, Rui Zhang
Format: Article
Language:English
Published: MDPI AG 2024-01-01
Series:Electronics
Subjects:
die attach
interface contact thermal resistance
thermal management
transient thermal analysis
structure function
high-power laser diode
Online Access:https://www.mdpi.com/2079-9292/13/1/203

Internet

https://www.mdpi.com/2079-9292/13/1/203

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