Solder Wear Study on Electronic Boards using Nanoindentantions
This paper presents a method for analysing the differences in solder interfaces between a new and an used printed circuit board (PCB). The study was carried out using the nanoindentation technique, the properties analysed being those of homogeneity, elasticity/rigidity of the solder paste on the con...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Editura Universităţii din Oradea
2022-10-01
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| Series: | Journal of Electrical and Electronics Engineering |
| Subjects: | |
| Online Access: | https://electroinf.uoradea.ro/images/articles/CERCETARE/Reviste/JEEE/JEEE_V15_N2_OCT_2022/Manea_Moldovan_JEEE.pdf |