Packaging of micro-lens arrays to photonic integrated circuits using beam shape evaluation

Packaging of micro-lens arrays to photonic integrated circuits using beam shape evaluation

We propose a method for aligning and attaching micro-lens arrays to photonic integrated circuits (PICs). Unlike the conventional approach of assessing power coupled to a fiber directly, our method utilizes a beam profiler. This profiler allows us to optimize the lens position by analyzing the transm...

Full description

Bibliographic Details
Main Authors: Kamil Gradkowski, Padraic E Morrissey, Peter O’Brien
Format: Article
Language:English
Published: IOP Publishing 2024-01-01
Series:JPhys Photonics
Subjects:
photonic packaging
photonic integrated circuits
micro-lens arrays
Online Access:https://doi.org/10.1088/2515-7647/ad5bd2

Internet

https://doi.org/10.1088/2515-7647/ad5bd2

Similar Items